<progress id="5hzrd"></progress><var id="5hzrd"></var>
<var id="5hzrd"><strike id="5hzrd"><thead id="5hzrd"></thead></strike></var>
<var id="5hzrd"><strike id="5hzrd"><listing id="5hzrd"></listing></strike></var>
<var id="5hzrd"><strike id="5hzrd"></strike></var>
<var id="5hzrd"></var>
<cite id="5hzrd"><strike id="5hzrd"></strike></cite><var id="5hzrd"><video id="5hzrd"><listing id="5hzrd"></listing></video></var>
<var id="5hzrd"><strike id="5hzrd"><thead id="5hzrd"></thead></strike></var>
<var id="5hzrd"><strike id="5hzrd"></strike></var>
<var id="5hzrd"></var>
 
The current positionHome > Ability and research
CONTACT US
Address: exhibition of zhenjiang city, jiangsu province jade tao wang village 47
Website: http://zfybtt.com
Zip code: 212001
Capacity Produce
SOURCEadminTIME2015/12/28 8:30:00

Item

Content

Capacity

1

Layer Count

2-30

2

Panel Size(Max)

24.2"30.2"

3

Panel Size(Min)

12"12"(I-Ag, OSP: 4"6")

4

Board Thickness(Max)

 8.0mm(I-Ag,OSP:5.0mm,ENIG:4.5mm)

5

Board Thickness(Min)

0.4mm

6

Thin Core Thickness(Min)

3mil

7

Finished Board Thickness Tolerance(Board Thickness0.8mm)

10%

8

Finished Board Thickness Tolerance(0.4mmBoard Thickness<0.8mm)

3mil

9

Warpage(Min)

0.7%

10

Drill Size(Max)

6.7mm

11

Drill Size(Min)

0.20mm

12

Base Copper Thickness of Outer Layer(Min)

1/3 OZ

13

Base Copper Thickness of Outer Layer(Max)

4 OZ

14

Base Copper Thickness of inner Layer(Min)

1/3 OZ

15

Base Copper Thickness of inner Layer(Min)

3 OZ

16

Dielectric Thickness(Min)

2mil

17

Laminate Type

Tg135 FR-4  S1141Tg150 FR-4  S1000Tg170 FR-4  S1000-2_˹Rϵķϩϵ

18

Aspect Ratio(Max)

12:1

19

Hole Diameter Tolerance(PTH)

2mil

20

Hole Diameter Tolerance(NPTH)

1mil

21

Hole Position Tolerance(Compared with CAD Data)

2mil

22

Holewall Copper Thickness(Full Hole)

1mil

23

Holewall Copper Thickness(Blind Via)

0.6mil

24

Line Width/Spacing of Outer Layer(Min)

T/T OZ: 3mil/3milH/H OZ: 4mil/4mil

1/1 OZ: 6mil/6mil2/2 OZ: 8mil/8mil

3/3 OZ: 10mil/10mil

25

Line Width/Spacing of Inner Layer(Min)

H/H OZ: 3mil/3mil1/1 OZ: 3mil/3mil

2/2 OZ: 6mil/6mil3/3 OZ:  8mil/8mil

26

Etching Tolerance

20%

27

Image to Image Tolerance(Min)

5mil

28

Outer Image to Hole Tolerance(Min)

3mil

29

Outer Image to Edge Tolerance(Min)

6mil

30

Hole to Hole Tolerance(Min)

2mil

31

Solder Mask Registration Tolerance

2mil

32

Solder Mask Thickness(Min)

10m

33

Solder Mask Bridge Width(Min)

2.5mil

34

Solder Mask Plugged Hole Diameter

d>0.75mm: Solder in Hole

d0.75mm:No Solder Ball in Hole

35

Minimum Nickel Thickness of ENIG(Max)

4.0m

36

Minimum Gold Thickness of ENIG(Max)

0.05m

37

Solder Thickness on XFP (HAL) (Max)

25.4m

38

Solder Thickness except XFP (HAL) (Min)

2.54m

39

Routing Dimension Tolerance(Edge to Edge)(Min)

4mil

40

Routing Dimension Tolerance(Hole to Edge)(Min)

4mil

41

Radius by Routing (Internal Angle)(Min)

R0.4mm

42

Countersink Hole Size(Top Angle is 165)(Max)

6.35mm

43

Slot WidthMin

0.5mm

44

Slot TolerancePTHL2W+0.15mm

0.076mm

45

Slot Tolerance(PTHL<2W+0.15mm

0.076mm

46

V-CUT Remaining Thickness Tolerance(MIN)

0.05mm

47

V-CUT Angle Tolerance(30- 60(Min)

4

48

V-CUT MISREGISTRATION MIN

3mil

49

V-CUT Board Thickness(Min/Max

0.5mm/2.4mm

50

V-CUT to Hole Tolerance(Min)

5mil

51

V-CUT to V-CUT Location tolerance(Min)

4mil

52

V-CUT to Edge Tolerance(Min)

5mil

53

Impedance Tolerance(Min)

7%

54

Minimum Tin Thickness of Immersion Tin

1.0m

55

Nickel Thickness of Gold Finger Plating

2.54-7.62m

56

Gold Thickness of Gold Finger Plating

0.25-0.8m

57

Film Thickness of OSP

100-200u"

58

Gold Finger Chamfer Angle Tolerance

2

59

Gold Finger Chamfer Depth Tolerance

5mil

 

The official website
Subscription
APP

Copyright(C) 2015-2016 Chongqing Hangling PCB Co.,Ltd    

Add:No.2166 Xinglong Road Yongchuan Chongqing. Tel:023-49826118-8220


久热这里在线精品8